Semiconductor assembly equipment plays a vital role in the electronics industry. They are used to assemble tiny semiconductor devices into key components of electronic products. These equipment are involved in a variety of different applications, including: chip packaging, surface mount technology (SMT), circuit board assembly, etc. The requirements for dust-free are very strict, because tiny dust particles can seriously affect the performance and quality of semiconductor devices. During the semiconductor manufacturing and assembly process, even tiny dust or impurities can cause short circuits, damage or poor function of the device.

After years of technological accumulation, Heling has mastered the key material technology of dust-free drag chains and the core automated production and molding process of dust-free drag chain sheaths. The finished product has a bending resistance of more than 20 million times, which greatly reduces the dust particles and noise generated by cables during equipment operation, protects cables, reduces the number of equipment stoppages, saves equipment maintenance time, and reduces costs.

Features

Bending life (10,000 times): ≥1000

Maximum allowable support (mm): R40<1300; R55<1600; R70<3000

Temperature range (°C): -10~80

Cable diameter (mm): 2-16

Maximum allowed acceleration: 4 m/s²

Maximum operating speed (m/s): 2

Clean room cleanliness: Class 100

Product certification: IPA; SGS